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filingDate 2020-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04b251de99c7efeed941b93d39dd32e0
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publicationDate 2023-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2023018758-A1
titleOfInvention Cu-Ni-Si-BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING SAME, AND CURRENT-CARRYING COMPONENT
abstract A copper alloy sheet material having improved etching characteristics contains (in mass %) Ni: 1.00 to 4.50%, Si: 0.10 to 1.40%, and optionally one or more kind of Co, Mg, Cr, P, B, Mn, Sn, Ti, Zr, Al, Fe, Zn, and Ag. The sheet material has an area ratio SB/SS of 0.40 or more in an EBSD measurement on a cross section perpendicular to a rolling direction, wherein SS represents area of a region satisfying at least one of conditions of a crystal orientation difference from the S1 {241} <112> orientation of 10° or less and a crystal orientation difference from the S2 {231} <124> orientation of 10° or less, and SB represents an area of a region having a crystal orientation difference from the Brass {011} <211> orientation of 10° or less.
priorityDate 2020-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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