http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023009805-A1

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filingDate 2021-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbf33b90c2df44716880d7dc662dcfaf
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publicationDate 2023-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2023009805-A1
titleOfInvention Surface acoustic wave device and method for fabricating the same
abstract A method for fabricating a surface acoustic wave (SAW) device includes the steps of forming a first dielectric layer on a substrate, forming a piezoelectric layer on the first dielectric layer, forming a second dielectric layer on the piezoelectric layer, performing a photo-etching process to remove the second dielectric layer for forming a recess in the second dielectric layer, forming a metal layer in the recess, and then performing a planarizing process to remove the metal layer for forming an electrode in the recess.
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Total number of triples: 26.