Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88fc7f9eb617072238851d46591a0c76 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-02574 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-059 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-02559 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H3-08 |
filingDate |
2021-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbf33b90c2df44716880d7dc662dcfaf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebe1aa15817f4304765f4798af6cd66f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea5f1b2b19c83b966a7731ae027dffac |
publicationDate |
2023-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2023009805-A1 |
titleOfInvention |
Surface acoustic wave device and method for fabricating the same |
abstract |
A method for fabricating a surface acoustic wave (SAW) device includes the steps of forming a first dielectric layer on a substrate, forming a piezoelectric layer on the first dielectric layer, forming a second dielectric layer on the piezoelectric layer, performing a photo-etching process to remove the second dielectric layer for forming a recess in the second dielectric layer, forming a metal layer in the recess, and then performing a planarizing process to remove the metal layer for forming an electrode in the recess. |
priorityDate |
2021-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |