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filingDate 2022-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2022-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2022352057-A1
titleOfInvention Method of manufacturing electronic devices and corresponding electronic device
abstract A substrate includes electrically-conductive tracks. A semiconductor chip is arranged on the substrate and electrically coupled to selected ones of the electrically-conductive tracks. Containment structures are provided at selected locations on the electrically-conductive tracks, where the containment structures have respective perimeter walls defining respective cavities. Each cavity is configured to accommodate a base portion of a pin holder. These pin holders are soldered to the electrically-conductive tracks within the cavities defined by the containment structures. Each containment structure may be formed by a ring of resist material configured to receive solder and maintain the pin holders in a desired alignment position.
priorityDate 2021-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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