| abstract |
A method for manufacturing a solid state device with a self-forming nanogap includes patterning a first metallic layer (M1) to form a first electrode on a substrate; depositing a self-assembling monolayer, SAM, layer over and around the first electrode; forming a second metallic layer (M2) in contact with the SAM layer and the substrate; and touchlessly removing parts of the second metallic layer (M2) that is formed directly above the SAM layer, to form a second electrode, and a nanogap between the first electrode and the second electrode. |