| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2022-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfad1fdfef6126bcbec463e5b8ae370c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0be254b7d9824eb3715d7fca002aa74a |
| publicationDate |
2022-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2022298380-A1 |
| titleOfInvention |
Polishing composition, polishing method and method for producing semiconductor substrate |
| abstract |
Provided is a polishing composition capable of polishing a layer containing an element in group 13 of the periodic table in a content of more than 40 mass % at a high polishing speed. Provided is a polishing composition for use in polishing an object to be polished having a layer containing an element in group 13 of the periodic table in a content of more than 40 mass %, the polishing composition containing a cationically modified silica, a polyalkylene glycol, and an acid. |
| priorityDate |
2021-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |