| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_970db33120da054de157f6421a736ad4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-30 |
| filingDate |
2020-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a64e9ceda5842e19777bbcc308889f41 |
| publicationDate |
2022-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2022297243-A1 |
| titleOfInvention |
Solder paste and solder bonded body |
| abstract |
By using a solder paste including powder of a lead-free solder alloy mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder alloy, in which the metal particle is formed. of a Cu—Ni alloy having a Ni content of 0.1 to 90% by mass, or formed of a Cu—Co alloy having a Co content of 0.1 to 90% by mass, a solder bonded body that has heat resistance, thermal conductivity, and reliability higher than ever can be formed. |
| priorityDate |
2019-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |