| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53252 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2021-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f950192a2a426c4d9d6c9bc457d4d68e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cd4d66a167415f3e602c69dd84d76e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afd6a9cdb322c142853b0401f0397ed3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c6031a5afec81862bde6addc80ed200
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1214781e767f02d5813e5693ec606e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b3b4f3a959e5c8ecda4bdd0f7452d1a |
| publicationDate |
2022-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2022277964-A1 |
| titleOfInvention |
Chemical mechanical planarization slurries and processes for platinum group metals |
| abstract |
A method for planarizing a metal conductor layer embedded in a dielectric layer is provided. The method includes removing a portion of an overburden of the metal conductor layer that is formed over the dielectric layer with a first CMP slurry. The method also includes removing a remaining portion of the overburden of the metal conductor layer with a second CMP slurry to expose upper portions of the dielectric layer. |
| priorityDate |
2021-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |