| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cc4e13141d402ceb885f368dfa042348 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0314
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0274 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G09F9-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-0026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-022491
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4691 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 |
| filingDate |
2020-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e027418e993789d164374b25b2475cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb1b0ba1000b7540895450103aa037d1 |
| publicationDate |
2022-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2022272830-A1 |
| titleOfInvention |
Flexible transparent copper circuit, preparation method therefor, and application thereof |
| abstract |
A flexible transparent copper circuit, a preparation method therefor, and a application thereof. The preparation method specifically comprises the following steps: (1) uniformly coating a gel containing copper powder on one side of a glass sheet, and drying same to form a copper film layer; and (2) placing the one side of the glass sheet coated with the copper film layer opposite to a polymer material, scanning the other side using a laser beam such that the copper film layer is transferred to a suropposite to of the polymer material, and performing post-processing to obtain a flexible transparent copper circuit. The copper circuit obtained by the preparation method has good potential in flexible photovoltaic applications. Moreover, since laser processing has fast speed and inherent flexibility, the transferred metal circuit can be freely designed, thus improving the processing efficiency and facilitating mass production. |
| priorityDate |
2019-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |