| abstract |
The present invention includes a mixed composition of an organosilicon compound (A) represented by formula (a1), an organosilicon compound (B) represented by formula (b1) and a curing inhibitor (C), and a mixed composition of the organosilicon compound (A) represented by formula (a1), the organosilicon compound (B) represented by formula (b1), the curing inhibitor (C) and water (D). n R a1 —Si(X a1 ) 3 (a1)n n Si(R b1 ) b20 (X b1 ) 4-b20 (b1) |