| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f34119b232d292c72e632b62008eca90 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02J2310-23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3758
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10015 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02J50-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02J50-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| filingDate |
2022-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed9e0015b79f847ede95829fc3d5cf9e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15d9131bb0dda690e9f6849b6e1e710f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f1c1989192f307d63cc590a6c9690ce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f96505101ca122b9f8228065e7b53d12 |
| publicationDate |
2022-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2022248545-A1 |
| titleOfInvention |
Electronic package and device including same |
| abstract |
Various embodiments of an electronic package and implantable medical device are disclosed. The electronic package includes a nonconductive substrate having a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface. The package also includes a conductive layer hermetically sealed to the first major surface of the substrate and over the opening; a conductor block disposed in the opening and extending beyond the second major surface of the substrate, where the conductor block is electrically connected to the conductive layer; and an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer. The package also includes a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, where the electronic device is disposed within a cavity of the cover. |
| priorityDate |
2021-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |