http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022246438-A1

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filingDate 2021-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_686713ff398ffc6d38cee2470068fc6e
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publicationDate 2022-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2022246438-A1
titleOfInvention Cyclic plasma etch process
abstract A method for processing a substrate includes performing a cyclic plasma etch process including a plurality of cycles, where each cycle of the plurality of cycles includes: causing chemical reactions with the surface of the substrate by exposing a surface of the substrate to fluorine radicals extracted from a first gas discharge plasma formed using a first gaseous mixture including a non-polymerizing fluorine compound; cooling the substrate and concurrently removing residual gaseous byproducts by flowing a second gaseous mixture over the substrate, and at the same time, suppressing the chemical reactions with the surface of the substrate; and performing a plasma surface modification process by exposing the surface of the substrate to hydrogen radicals extracted from a second gas discharge plasma formed using a third gaseous mixture including gases including nitrogen and hydrogen.
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