http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022223420-A1

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filingDate 2021-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2022-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2022223420-A1
titleOfInvention Manufacturing method for semiconductor structure, and semiconductor structure
abstract A manufacturing method for a semiconductor structure includes: a substrate is provided, the substrate including a first region and a second region; a dielectric layer is formed on the substrate; a first diffusion film layer having a first metal oxide layer is formed on the dielectric layer; the first diffusion film layer corresponding to the second region is removed; a second diffusion film layer is formed on the dielectric layer corresponding to the second region, the second diffusion film layer including a second metal oxide layer interfacing with the dielectric layer; and an annealing treatment is performed to diffuse a first metal element in the first metal oxide layer into the dielectric layer corresponding to the first region and diffuse a second metal element in the second metal oxide layer into the dielectric layer corresponding to the second region.
priorityDate 2021-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 24.