| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_06395e758a26cd80f23710d4536d5dfd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-043 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q1-42 |
| filingDate |
2022-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3308012d145c0c4aa0981e1ec441ccb2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a02cc5803b49b945d8977e8cf70ff48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39ef2975d16bc5bf81770f6b27ce554f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b121fffb74a1477e089c0ebe55864c1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90979fb50b10b1faffa910971f07ee07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_858c3e6ce01c3f8631bcc30e5c910c22 |
| publicationDate |
2022-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2022204765-A1 |
| titleOfInvention |
Thermoplastic resins for network applications |
| abstract |
The present disclosure relates to the use of thermoplastic resins in millimeter wave network applications. More specifically, it relates to polyamide materials meeting the requirements of dielectric performance in such applications. |
| priorityDate |
2020-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |