| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fda353b84ebf303bfc237d8bd8e22966 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-1466
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-144 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 |
| filingDate |
2020-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_917cb4e955b78bcb788f649e234f2eaa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8be844f3a539791f2ba580c556d7e076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be2017b96b7f0d8db37a46649c220027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_949ba814ad08698fe943fc0a04d9814a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3db2dd64152d899e698e46533acb8e5c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c09c97897603ca3ffb7ce8094ba7a74 |
| publicationDate |
2022-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2022169772-A1 |
| titleOfInvention |
Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring board |
| abstract |
The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package. |
| priorityDate |
2019-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |