| abstract |
The present disclosure discloses a photosensitive resin composition and a use the same. The resin composition of the present disclosure includes 40-70 parts by weight of an alkali-soluble resin, 20-50 parts by weight of a photopolymerizable monomer, 0.5-10.0 parts by weight of a photoinitiator, and 0.1-10.0 parts by weight of additives. The photopolymerizable monomer includes 0.5-15.0 parts by weight of a monomer containing carbonate structure. The photosensitive resin composition is used as a dry film resist. It has characteristics such as easy breakage of film strip, smaller film strip fragments, faster film strip speed, excellent flexibility, and good circuit resolution and adhesion, thereby effectively improving production efficiency and product yield. |