| abstract |
According to the present invention, there is provided a resin composition for sealing containing (A) an epoxy resin; (B) a curing agent; and (C) a filler, wherein the epoxy resin (A) includes an epoxy resin (A-1) having a naphthyl ether skeleton, and wherein the resin composition for sealing satisfies the following Formula (1): Formula (1) E 2 ×(α 2 ×10 −6 )×(175−Tg)×η 2 ≤0.3 n wherein, in Formula (1), Tg (° C.) is a glass transition temperature of a cured product of the resin composition for sealing,n nα 2 (ppm/° C.) is a coefficient of linear expansion over a range from 190° C. to 230° C. of the cured product, andn nE 2 (MPa) is a hot elastic modulus at 260° C. of the cured product, andn nη 2 (MPa) is a rectangular pressure at 175° C. of the resin composition for sealing as measured by the following method;n n(method)n nthe resin composition for sealing is injected, using a low-pressure transfer molding machine, into a rectangular-shaped flow channel having a width of 15 mm, a thickness of 1 mm, and a length of 175 mm under conditions of a mold temperature of 170° C. and an injection flow rate of 177 mm 3 /sec, a change in pressure over time is measured with a pressure sensor embedded at a position 25 mm away from an upstream tip of the flow channel, a lowest pressure (MPa) during a flow of the resin composition for sealing is measured, and the lowest pressure is regarded as the rectangular pressure. |