Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b26deb5501c8c3e152ec117a023ec0c9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_92d71a3e23389a3bca747290fc6464cf |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N23-2204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N1-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2001-362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-2602 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-2813 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N23-2202 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N35-00009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N1-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N1-2813 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32532 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N1-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-28 |
filingDate |
2019-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7aa69ec42705ba44685a11534eb4b46c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ece543c99e2729b6feb7322bef6289f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1daf187210abfbb1876d9a5d24c5f20a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_215c4d97d9851f76b4e81281d36ab910 |
publicationDate |
2022-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2022068598-A1 |
titleOfInvention |
Sample preparation system and method for electron microscope observation, plasma treatment apparatus, sputtering apparatus, and tape feeding mechanism used for sample preparation |
abstract |
Sample preparation system and method which enable electron microscope observation of a sample slice with simple structure and process are provided. The sample preparation system includes at least one of a plasma treatment apparatus and a sputtering apparatus, as well as a slice collecting apparatus. The plasma treatment apparatus is configured to feed a resin tape in a plasma irradiation area to irradiate the resin tape with plasma, thereby continuously hydrophilizing the resin tape. The sputtering apparatus is configured to feed the resin tape in a sputtering area to continuously perform sputtering on the resin tape, thereby imparting conductivity to the resin tape. The slice collecting apparatus is configured to serially collect slices cut out from a sample onto the resin tape having been subjected to plasma treatment or sputtering. |
priorityDate |
2018-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |