| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1073 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76882
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76858
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2020-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4bd6ff0408ae7d3107a71ddf75070d40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32b128c3b1e91b7c0cce6fc0a7cf826d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_637b35587c5680319a7607d72232ea9c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3006c1f908c4e0ec9f6cf497d2feea6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36a002b6d54fdcf79424c643d37a7872
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2df9cd3b21c80cd399783b16ef36c5b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9987ef4649a944052403a78ea0800f4f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a205092968ac173841c046385946454 |
| publicationDate |
2022-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2022037203-A1 |
| titleOfInvention |
Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same |
| abstract |
An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process. |
| priorityDate |
2020-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |