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filingDate 2019-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2021-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2021407885-A1
titleOfInvention Two-pack curable composition set, thermally conductive cured product, and electronic device
abstract A two-pack curable composition set having: a first agent comprising an organopolysiloxane having a branched structure and having a vinyl group at least at an end or in a side chain, a thermally conductive filler, a silica powder, and a platinum catalyst, and having a viscosity at 25° C. at a shear rate of 10 s −1 of 20 to 150 Pa·s; and a second agent comprising an organopolysiloxane having a branched structure and having a vinyl group at least at an end or in a side chain, and a polydimethylsiloxane having a hydrosilyl group at least at an end or in a side chain, a thermally conductive filler, and a silica powder, and having a viscosity at 25° C. at a shear rate of 10 s −1 of 20 to 150 Pa·s.
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