| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c721fe8dc4d1b8f924e7e673bd5c2edb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K13-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14 |
| filingDate |
2019-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7dcf2d4d064afe7e9f29c207fda301f4 |
| publicationDate |
2021-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2021395594-A1 |
| titleOfInvention |
Highly conductive additives to reduce settling |
| abstract |
A composition comprising a reactive organic matrix and majority amount of large conductive particles referred to as the primary filler and a minority amount of significantly smaller conductive particles, referred to as the secondary filler. The primary filler and secondary filler are dispersed in a reactive organic matrix and the secondary filler comprises particles with anti-settling characteristics to prevent the primary filler particles from settling without compromising the overall conductivity of the composition. |
| priorityDate |
2018-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |