| abstract |
The present invention relates to a moulding compound which contains at least 50 wt. % of a semicrystalline poly amide component and the moulding compound contains a filler which imparts conductivity to the moulding compound, wherein the moulding compound does not have a crystallite melting point (Tm) below 50° C. and the polyamide component contains components A and B, A) PA homopolymer of the type PA X.Y or PAZ, where X is a diamine radical (DA), Y is a dicarboxyl radical (DC), and Z is an alpha-omega amino acid radical; B) PA copolymer of the type PA X′.Y′, where X is a diamine radical (DA′) and Y′ is a dicarboxyl radical (DC′); wherein a portion of the diamine radical (DA′) is replaced by a polyether having at least two amino termini or at least two hydroxy termini; wherein the proportion of polyether in the sum of components A and Bis between 0.5 and 15 wt. % and wherein the proportion of filler is 2.5 to 6 wt. % based on the total mass of the poly amide component and the filler. The invention also relates to a method for producing same and using same, and to hollow profiles comprising same. |