| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a62555ff12316a9a118542896b4c0af7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-1201
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2227-323 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-3276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1259
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-77
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L51-0021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-00 |
| filingDate |
2018-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3be95705742d4cefdd076a4f8b39f6f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d89daa65242f459aa19deaf68029685c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1526484da35fd19d960677cb071444d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc961732ad58fc98194e99b203283551
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a062ca16f7a1f237b816dc7c18e48c8d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f5085204e8131b32b03503f5fc6a3fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9f0ae395a8eff316ec0d9b379e9de45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1d8fab69ffcf4c9bf7f5b697ac7f3fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c03ecd490bb07e32eb1d4f6eed92001d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d64d98d86581465b49fbb0adcb641b4 |
| publicationDate |
2021-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2021351353-A1 |
| titleOfInvention |
Manufacturing method of via-hole connection structure, array substrate and manufacturing method thereof, display device and manufacturing method thereof |
| abstract |
A manufacturing method of a via-hole connection structure, a manufacturing method of an array substrate and an array substrate are provided by the embodiments of the present disclosure, and the manufacturing method of the via-hole connection structure includes: forming an insulation layer on a base substrate and forming a first via hole in the insulation layer; forming a connection portion in the first via hole; forming a protection layer covering the connection portion on a surface of the insulation layer; forming a second via hole in the insulation layer and in the protection layer; removing at least a portion of the protection layer to expose the connection portion. |
| priorityDate |
2018-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |