| abstract |
The present disclosure relates to conductive adhesives and inks. The disclosed conductive adhesives include glues and epoxies, based on graphene and graphene/carbon composites and the methods of manufacture thereof, such conductive adhesives exhibiting excellent conductivity, thermal properties, durability, low curing temperatures, mechanical flexibility, and reduced environmental impact. Further, adhesives with conductive additives such as silver nanowires and the methods of production thereof are disclosed herein. |