http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021233808-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76832
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
filingDate 2020-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e780b98eafd0604ee66bfdad1af1491
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e98568cbe58287c3fc6e3040aaba6fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ccf414b8979ebb80c675f6c97d9a08b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54d544ab09c594f707869b59c30663df
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90a255708027d631ac195c88409a26a1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c41a5e74dd00547738bda4f066657f52
publicationDate 2021-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2021233808-A1
titleOfInvention Top vias with subtractive line formation
abstract Integrated chips and methods of forming the same include forming a conductive layer to a line height. A dielectric layer is formed over the conductive layer to a via height, with at least one opening that exposes a via region of the conductive layer. A conductive via is formed in the opening having the via height. The conductive layer is patterned to form a conductive line having the line height.
priorityDate 2020-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11169
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419579321

Total number of triples: 26.