http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021227696-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bac30e2e0d9b1032666a455becfc383 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1163 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1184 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-061 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2021-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abd91be525a1f989075f8cf7fb2808ec http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c110c883fb204315ae3a61ec50b03592 |
| publicationDate | 2021-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2021227696-A1 |
| titleOfInvention | Methods of etching conductive features, and related devices and systems |
| abstract | A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resist material layer over the anti-corrosive material layer. The etch-resist material layer may be deposited over the anti-corrosive material layer, and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device. A wet-etch process is performed to remove the exposed portions of the conductive material layer from the electrically insulating substrate, and the bi-component etch mask is removed to expose the remaining conductive material. Systems and devices relate to devices with patterned features. |
| priorityDate | 2016-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 53.