| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68372
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68368 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 |
| filingDate |
2020-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc4f44040ecd0cafe80b5decfb6723c3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1e60ad7b1c4a538fd7d8d4eb4fada09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c7e21351e98fe3d6baaa0e822116759
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_427ed1c0f5356c6129f61bc9a027fd02 |
| publicationDate |
2021-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2021202455-A1 |
| titleOfInvention |
Package structure and method of fabricating the same |
| abstract |
A package structure includes a circuits substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023048302-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11742275-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022130742-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022359465-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023065884-A1 |
| priorityDate |
2019-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |