| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B63-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L45-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-8418
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-2454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-8833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L45-1206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-821
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-253 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L45-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-24 |
| filingDate |
2019-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b32b8267e9abdabb86f7cd9095a5f34a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20cb38d9cb42b4a5b0c5a6558bd770e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac3c9365ac185348d99c5460aa0b0e23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa57155a94ec485068066724e7721ca7 |
| publicationDate |
2021-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2021193923-A1 |
| titleOfInvention |
Resistive random access memory cells integrated with vertical field effect transistor |
| abstract |
A one-transistor-two-resistor (1T2R) resistive random access memory (ReRAM) structure, and a method for forming the same, includes forming a vertical field effect transistor (VFET) including an epitaxial region located above a channel region and below a dielectric cap. The epitaxial region includes two opposing protruding regions of triangular shape bounded by <111> planes that extend horizontally beyond the channel region. A ReRAM stack is conformally deposited on the VFET. The ReRAM stack includes an oxide layer located directly above the epitaxial region, a top electrode layer directly above the oxide layer and a metal fill above the top electrode layer. Each of the two opposing protruding regions of the epitaxial region acts as a bottom electrode for the ReRAM stack. |
| priorityDate |
2019-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |