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filingDate 2018-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02bb2e6d824ec2931e4b056e6e7a9816
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publicationDate 2021-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2021095153-A1
titleOfInvention Copper ink
abstract A copper-based ink contains copper hydroxide and diethanolamine. The ink may be coated on a substrate and decomposed on the substrate to form a conductive copper coating on the substrate. The ink is low cost and micron-thick traces of the ink may be screen printed and thermally sintered in the presence of up to about 500 ppm of oxygen or photo-sintered in air to produce highly conductive copper features. Sintered copper traces produced from the ink have improved air stability compared to traces produced from other copper inks. Sintered copper traces having sheet resistivity of about 20 mΩ/□/mil or less may be obtained for 5-20 mil wide screen-printed lines with excellent resolution.
priorityDate 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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