Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8abb210936dc3b56af93e346a2335b7f |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M7-0081 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-143 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M1-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-104 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M1-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-104 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
filingDate |
2018-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02bb2e6d824ec2931e4b056e6e7a9816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51b040a0ebad7709ad3a840db588f6ef http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4349b20d0ab7b982ae4a8db52891dd2d |
publicationDate |
2021-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2021095153-A1 |
titleOfInvention |
Copper ink |
abstract |
A copper-based ink contains copper hydroxide and diethanolamine. The ink may be coated on a substrate and decomposed on the substrate to form a conductive copper coating on the substrate. The ink is low cost and micron-thick traces of the ink may be screen printed and thermally sintered in the presence of up to about 500 ppm of oxygen or photo-sintered in air to produce highly conductive copper features. Sintered copper traces produced from the ink have improved air stability compared to traces produced from other copper inks. Sintered copper traces having sheet resistivity of about 20 mΩ/□/mil or less may be obtained for 5-20 mil wide screen-printed lines with excellent resolution. |
priorityDate |
2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |