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publicationDate 2021-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2021080327-A1
titleOfInvention Vacuum Packaged Infrared Sensor Arrays
abstract A vacuum packaged infrared sensor array with excellent performances is described. The individual pixel of the infrared sensor array has a thermopile made of recrystallized amorphous silicon resulting in low resistance, low thermal noise, high integration and high sensitivity. The vacuum in the packaged infrared sensor array is enhanced by low temperature oxidization of a porous silicon layer formed in a lid silicon substrate which is bonded with the infrared sensor array silicon substrate. The driving force for lowering oxidization temperature is reduction in surface energy of porous silicon. It has been reported that the surface energy is 0.0001 J/cm 2 for porous silicon and 0.2 J/cm 2 for planar crystal silicon.
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