| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eccd894c99fea2d1c0c8735872bb2309 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2219-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2019-3425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2019-2078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2019-0448
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2219-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K19-3483
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K19-2007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K19-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K19-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K19-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K19-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K19-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K19-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K19-20 |
| filingDate |
2019-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7bd16576f9a1a6747b2fba95c797e56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eeb6bb7d1ae2c7afb3a3234a83b47c96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2104e8f8e2669d56590c22bf8cb21ce |
| publicationDate |
2021-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2021062091-A1 |
| titleOfInvention |
Dielectric materials |
| abstract |
The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021355383-A1 |
| priorityDate |
2018-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |