| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c19a91365ed494d9fe27d24190d4459f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-748
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2250-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2260-021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2260-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2260-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2262-0276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2262-0269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2250-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2262-101 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-062
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-022 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate |
2018-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6d0e5291c6cfa815eca3ac01dc858f2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4243ed4998c932ebe954d0d76d9a5062
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0231b14bf3a0ab5ff20a973b3f52ccaa |
| publicationDate |
2021-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2021014967-A1 |
| titleOfInvention |
Metal-clad laminated board, metal member provided with resin, and wiring board |
| abstract |
A metal-clad laminated board includes an insulating layer and a metal layer, in which the insulating layer includes a cured product of a resin composition containing a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated double bond; and a crosslinkable curing agent having an unsaturated double bond in the molecule, and containing 40 to 250 parts by mass of silica particles with respect to 100 parts by mass in total of the modified polyphenylene ether compound and the crosslinkable curing agent, the resin composition contains 0.2 to 5 parts by mass of a first silane coupling agent having an unsaturated double bond in the molecule with respect to 100 parts by mass of the silica particles, and a contact surface of the metal layer in contact with the insulating layer is surface-treated with a second silane coupling agent having an amino group in the molecule. |
| priorityDate |
2017-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |