| abstract |
A quantum dot LED package is disclosed. The quantum dot LED package includes: a heat dissipating reflector having a through cavity; a quantum dot plate accommodated in the upper portion of the through cavity; an LED chip accommodated in the lower portion of the through cavity and whose top surface is coupled to the lower surface of the quantum dot plate; electrode pads disposed on the lower surface of the LED chip and protruding more downward than the lower surface of the heat dissipating reflector; and a resin part formed in the through cavity to fix between the LED chip and the reflector and between the quantum dot plate and the reflector. |