http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020373274-A1

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filingDate 2020-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2020-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2020373274-A1
titleOfInvention Substrate bonding apparatus
abstract A substrate bonding apparatus for bonding a first substrate to a second substrate includes: a first bonding chuck including: a first base; a first deformable plate provided on the first base to support the first substrate; and a first pneumatic adjustor configured to deform the first deformable plate by adjusting a first pressure in a first cavity formed between the first deformable plate and the first base; and a second bonding chuck including: a second base; a second deformable plate provided on the second base to support the second substrate; and a second pneumatic adjustor configured to deform the second deformable plate by adjusting a second pressure in a second cavity formed between the second deformable plate and the second base. The first deformable plate is deformed such that a first distance between the first base and the first deformable plate is varied based on the first pressure, and the second deformable plate is deformed such that a second distance between the second base the second deformable plate is varied based on the second pressure.
priorityDate 2019-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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