| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f0c17fb0be15e18e811be589c822b4c8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B2027-0138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B2027-0178
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B2027-0116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B2027-0134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B2027-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4852
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-32 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B27-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B26-0833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B27-4272
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B26-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0062
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B27-0172
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 |
| filingDate |
2020-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_501667a0e1a20b84f281469b2fd96a7f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffc03c3d62d128b0bc737a7afa6a4ebf |
| publicationDate |
2020-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020357968-A1 |
| titleOfInvention |
Bonding methods for light emitting diodes |
| abstract |
Disclosed herein are techniques for bonding components of LEDs. According to certain embodiments, a method includes performing p-side processing of a first component. The p-side processing is performed from a direction adjacent to a surface of a p-side semiconductor layer of the first component that is opposite to an active light emitting layer of the first component. The method also includes aligning first contacts of the first component with second contacts of the second component, and subsequently performing hybrid bonding of the first component to the second component by performing dielectric bonding of a first dielectric material of the first component with a second dielectric material of the second component at a first temperature, and subsequently performing metal bonding of the first contacts of the first component with the second contacts of the second component by annealing the first contacts and the second contacts at a second temperature. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11631587-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11355666-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11569091-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11158761-B2 |
| priorityDate |
2019-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |