| abstract |
A method of forming complementary metal-oxide-semiconductor (CMOS) nanosheet devices is provided. The method includes forming at least two adjacent trimmed stacks of sacrificial sheet segments and semiconductor nanosheet segments on a substrate, with a dummy gate structure and sidewall spacers on each of the at least two adjacent trimmed stacks. The method further includes forming a protective cap layer over the trimmed stacks, and forming a sacrificial fill layer on the protective cap layer. The method further includes forming a recess through the sacrificial fill layer and protective cap layer between the stacks, depositing a recess liner in the recess, and forming a dielectric fill layer in the recess on the recess liner. The method further includes forming a capping layer on one of the trimmed stacks, removing the sacrificial fill layer from another one of the trimmed stacks, and forming a source/drain on the semiconductor nanosheet segments. |