Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b6caea61bfde8a45e01a8deabff80d97 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9222 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8083 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0651 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-09181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05567 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9202 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73251 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80357 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B43-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-11582 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B43-27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-11582 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
filingDate |
2020-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e654fcbb57f34f2053e8d5563d845a05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_995d7eb2fafadedf5380595839e4405d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acee2aedae65067a83d2fc1bac774d00 |
publicationDate |
2020-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2020258816-A1 |
titleOfInvention |
Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer |
abstract |
A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a carrier substrate. Memory stack structures vertically extend through the alternating stack. Each memory stack structure includes a respective vertical semiconductor channel and a respective memory film. A pass-through via structure vertically extends through a dielectric material portion that is adjacent to the alternating stack. The memory die can be bonded to a logic die containing peripheral circuitry for supporting operations of memory cells within the memory die. A distal end of each of the vertical semiconductor channels is physically exposed by removing the carrier substrate. A source layer is formed directly on the distal end each of the vertical semiconductor channels. A backside bonding pad or bonding wire is formed to be electrically connected to the pass-through via structure. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11335602-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11417676-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11563018-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11315945-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11710724-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022123006-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11462560-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021407968-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11705367-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11574922-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11557601-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11557569-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022189984-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022046482-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11557570-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11380669-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112204734-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114093878-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022336418-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023063851-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11751408-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11631690-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11699652-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022047648-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11424221-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11756934-B2 |
priorityDate |
2019-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |