http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020258816-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b6caea61bfde8a45e01a8deabff80d97
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8083
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-09181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05567
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9202
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73251
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B43-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-11582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B43-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-11582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
filingDate 2020-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e654fcbb57f34f2053e8d5563d845a05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_995d7eb2fafadedf5380595839e4405d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acee2aedae65067a83d2fc1bac774d00
publicationDate 2020-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2020258816-A1
titleOfInvention Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer
abstract A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a carrier substrate. Memory stack structures vertically extend through the alternating stack. Each memory stack structure includes a respective vertical semiconductor channel and a respective memory film. A pass-through via structure vertically extends through a dielectric material portion that is adjacent to the alternating stack. The memory die can be bonded to a logic die containing peripheral circuitry for supporting operations of memory cells within the memory die. A distal end of each of the vertical semiconductor channels is physically exposed by removing the carrier substrate. A source layer is formed directly on the distal end each of the vertical semiconductor channels. A backside bonding pad or bonding wire is formed to be electrically connected to the pass-through via structure.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11335602-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11417676-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11563018-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11315945-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11710724-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022123006-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11462560-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021407968-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11705367-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11574922-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11557601-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11557569-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022189984-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022046482-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11557570-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11380669-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112204734-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114093878-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022336418-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023063851-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11751408-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11631690-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11699652-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022047648-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11424221-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11756934-B2
priorityDate 2019-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID31255
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450269560

Total number of triples: 73.