patent/US-2020258799-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020258799-A1

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filingDate	2020-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7394b999e5d940889147572465e2448 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b2eee3ddef2bf9816e15f47ec7865df http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_525b8ba4e94b3a955bf3c97df670b12c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c4cd88b31c38c1eda4874a86eb1aa8f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6d9647a22068e0eb5565e091f3bdda2
publicationDate	2020-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2020258799-A1
titleOfInvention	Semiconductor packages and manufacturing mehtods thereof
abstract	A semiconductor package includes a semiconductor chip and a redistribution layer structure. The redistribution layer structure is arranged to form an antenna transmitter structure and an antenna receiver structure over the semiconductor chip, wherein patterns of the antenna receiver structure are located at different levels of the redistribution layer structure, and at least one pattern of the antenna transmitter structure is at the same level of the topmost patterns of the antenna receiver structure.
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priorityDate	2016-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 72.