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publicationDate 2020-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2020235063-A1
titleOfInvention Three-dimensional integrated circuit and method of manufacturing the same
abstract Provided are a three-dimensional integrated circuit (3DIC) and a method of manufacturing the same. The 3DIC includes a first wafer, a second wafer, and a hybrid bonding structure. The second wafer is bonded to the first wafer by the hybrid bonding structure. The hybrid bonding structure includes a blocking layer between a hybrid bonding dielectric layer and a hybrid bonding metal layer.
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