| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2006-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7682
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28562 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76876
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G41-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02645
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76859 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01G41-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-28 |
| filingDate |
2018-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b4f18a33dff0c9fb393fb7b3a0bf9cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b89acf3613415adf3916e0e82a0f9e3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ceb0b79da8db5f310449e672a8a86d3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4ad4f5a08e7132be46e02da26120853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cc404f978506f8351fb532e12b15537 |
| publicationDate |
2020-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020211843-A1 |
| titleOfInvention |
Methods of forming tungsten structures |
| abstract |
Described are methods for forming a multilayer conductive structure for semiconductor devices. A seed layer is formed comprising a metal and an additional constituent that in combination with the metal inhibits nucleation of a fill layer of the metal formed over the seed layer. Tungsten may be doped or alloyed with silicon to form the seed layer, with a tungsten fill being formed over the seed layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11646206-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023223342-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11791268-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11244903-B2 |
| priorityDate |
2018-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |