| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce23be6ef7e6b8a191a78b43f71e57a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-012 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F122-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-232
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-015 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-232
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F122-14 |
| filingDate |
2019-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9854c8043a7d37ef0d94be81e3fa1e25 |
| publicationDate |
2020-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020194179-A1 |
| titleOfInvention |
Polymeric monolithic capacitor |
| abstract |
Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure. The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents. |
| priorityDate |
2015-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |