| abstract |
A solventless pressure sensitive adhesive composition is provided, having from about 65% to about 99.5%, by weight, of a first monomer comprising 1,1-disubstituted alkene monomer with a low Tg and from about 0.5% to about 25%, by weight, of a second monomer comprising 1,1-disubstituted alkene monomer with an elevated Tg. The composition also contains a 1,1-disubstituted alkene multifunctional crosslinker. |