| abstract |
An implantable medical device including a hermetic housing, at least one electronic board housed in the housing, a module for heat dissipation and shock absorption, housed in the housing and arranged between the electronic board and an internal wall of the housing, the module having a first layer of thermal paste placed in the internal space of the housing and deposited on the electronic board, a second, metal layer of high thermal conductivity deposited on the first layer, a third layer of thermal paste deposited on the second layer and positioned so as to come into contact with the internal wall of the housing, the third layer having a structure with a plurality of cavities distributed over the entire area of contact of the third layer with the internal wall of the housing. |