http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020181453-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate | 2018-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4bd47af58356990176dc9f3eaf5acb4 |
| publicationDate | 2020-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2020181453-A1 |
| titleOfInvention | Method of polishing substrate and polishing composition set |
| abstract | Provided is a method of polishing a substrate in which a surface with high flatness and few defects can be realized with high efficiency. The method of polishing a substrate provided according to the present invention includes a plurality of stock polishing sub-steps that are performed by supplying a first polishing solution, a second polishing solution, and a third polishing solution in this order in a stock polishing step of a substrate. The relationships between a content. COM P1 of aa water-soluble polymer P 1 contained in the first polish ng solution, a content COM P2 of a water-soluble polymer P 2 contained in the second polishing solution, and a content COM P3 of a water-soluble polymer P 3 contained in the third polishing solution satisfy COM P1 <COM P2 <COM P3 , and any one of the following conditions is satisfied (1) the average primary particle diameter D A3 of abrasive A 3 contained in the third polishing solution is smaller than the average primary particle diameter D A1 of abrasive A 1 contained in the first polishing solution and the average primary particle diameter D A2 of abrasive A 2 contained in the second polishing solution; and (2) the third polishing solution does not contain abrasive A 3 . |
| priorityDate | 2017-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 162.