http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020168578-A1

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filingDate 2018-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec950982c7e49691e31fcb85447689f4
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publicationDate 2020-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2020168578-A1
titleOfInvention Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
abstract The present invention provides a Cu alloy bonding wire for a semiconductor device, where the bonding wire can satisfy requirements of high-density LSI applications. In the Cu alloy bonding wire for a semiconductor device, the abundance ratio of a crystal orientation <110> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis to crystal orientations on a wire surface is 25% or more and 70% or less in average area percentage.
priorityDate 2017-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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