| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f34119b232d292c72e632b62008eca90 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3756
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-543
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M2220-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-37512 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3758
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M2-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-1417
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M50-543 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-375
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 |
| filingDate |
2018-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e07eef98418cf43f44a56f11ae593b4c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f57a4baac195bbf8f6fd022cc336ed44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f96505101ca122b9f8228065e7b53d12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c14f94eeca1309df62c25e631f0c463b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c570196cbfc284dd0a407132e385f3a5 |
| publicationDate |
2020-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020137910-A1 |
| titleOfInvention |
Sealed package and method of forming same |
| abstract |
Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022272001-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11262267-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-D997360-S
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-D997361-S
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-D945622-S |
| priorityDate |
2018-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |