Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_036c8c785f2f6850cb81065d8ede2f98 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0231 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68359 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16235 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02373 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-566 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-528 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13 |
filingDate |
2019-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_059224803e1ca332210ddab0a58a2e9f |
publicationDate |
2020-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2020118898-A1 |
titleOfInvention |
Carrier for chip packaging and manufacturing method thereof |
abstract |
A carrier for a semiconductor chip mounting thereon and a manufacturing method thereof are provided. The carrier includes a fine redistribution structure, a plurality of conductive connectors, and an insulating layer. The fine redistribution structure has a first surface and a second surface opposite to each other, where the semiconductor chip is mounted on the first surface of the fine redistribution structure. The conductive connectors are disposed on the second surface of the fine redistribution structure and electrically coupled to the semiconductor chip through the fine redistribution structure. The insulating layer is disposed on the second surface of the fine redistribution structure to laterally cover the conductive connectors. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11355428-B2 |
priorityDate |
2018-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |