http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020107451-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0156 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| filingDate | 2019-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad4d0547d906aa7a0d7c3d77e502e35d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_858ac1a3b56d858adfb6c4cc37657c2e |
| publicationDate | 2020-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2020107451-A1 |
| titleOfInvention | Method of producing wiring board and conductive ink |
| abstract | Provided is a method of producing a wiring board capable of easily producing a wiring board, and a conductive ink. A method of producing a wiring board according to the present invention is a method of producing a wiring board using a transfer film including a support, a protective layer that is formed on one surface of the support and is peelable from the support, and a receiving layer that is formed on a surface of the protective layer and receives a solvent of a conductive ink including a conductive substance and the solvent, and the method has a wiring pattern forming step of forming a wiring pattern to the transfer film by performing printing using the conductive ink from a surface of the transfer film opposite to a surface on which the support is formed, an adhering step of, after the wiring pattern forming step, causing the surface of the transfer film on which the wiring pattern is formed opposite to the surface on which the support is formed to abut onto a substrate and causing the transfer film to adhere to the substrate, and a peeling step of, after the adhering step, peeling off the support from the transfer film caused to adhere to the substrate to obtain a wiring board. |
| priorityDate | 2017-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 112.