patent/US-2020093008-A1

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inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34cc68d9307155c37eec5ab95e48b429 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd4ee5340d7d7a82e4985b541987eca1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb0525ce356b7c1959440981e5705580 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5087822fa36e0602f57cc0c4e0d5a92
publicationDate	2020-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2020093008-A1
titleOfInvention	Contact structures with porous networks for solder connections, and methods of fabricating same
abstract	A contact pad includes a solder-wettable porous network ( 310 ) which wicks the molten solder ( 130 ) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.
priorityDate	2014-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

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