Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa80eed27901ac84139c7a7109c21e17 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10128 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-183 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0347 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4985 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-189 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5387 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
filingDate |
2019-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fb2c3fd08e6465293c00fae3f30ebc8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d157dd3e3f2bf9cdbd0d11c804b5992 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b8d26c674a5159bd9c2c98ad8e78bf0 |
publicationDate |
2020-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2020084888-A1 |
titleOfInvention |
Flexible circuit board, chip package including the same, and electronic device including the chip package |
abstract |
According to an embodiment, a flexible circuit board includes: a first substrate; a second substrate disposed on the first substrate and including an opening; a first conductive pattern part disposed on a bottom surface of the first substrate; a second conductive pattern part disposed on a top surface of the second substrate; a third conductive pattern part disposed between the first substrate and the second substrate; and an upper protective layer partially disposed on the second conductive pattern part and including a first open region, wherein the third conductive pattern part includes: a first inner lead pattern part disposed in the opening of the second substrate; and a first extension pattern part connected to the first inner lead pattern part, the second conductive pattern part includes: a second inner lead pattern part disposed in the first open region of the upper protective layer; and a second extension pattern part connected to the second inner lead pattern part, and a number of first inner lead pattern parts is greater than a number of second inner lead pattern parts. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114126205-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11395403-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11145705-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10912192-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11622444-B2 |
priorityDate |
2018-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |