| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a4b3fbec4b2ca9303a13095cd2cce7db |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0171 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L41-1136
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00277
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0058 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
| filingDate |
2019-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d7b9a7304df15e058fe6a190142a303
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92cb99bcb2301d61c70b367636240f9b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ef1e2a8ed07c956678c8a6f2b53efd0 |
| publicationDate |
2020-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020079646-A1 |
| titleOfInvention |
Encapsulated microelectromechanical structure |
| abstract |
A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023171025-A1 |
| priorityDate |
2006-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |